Distributed power supplies for microelectronic workpiece processing tools

ABSTRACT

An apparatus and method for processing microelectronic workpieces. The apparatus can include a housing at least partially enclosing a process environment, with a first processing chamber and a second processing chamber positioned within the housing. The first processing chamber can have a first electrically powered device, such as a first anode and/or a first cathode, and the second processing chamber can have a second electrically powered device, such as a second anode and/or a second cathode. A first power supply is electrically coupled to the first processing chamber to provide electrical power to at least one of a first anode and a first cathode, and a second power supply is electrically coupled to the second processing chamber to provide electrical power to at least one of the second anode and the second cathode. A first conductive link between the first power supply and the first processing chamber can be electrically decoupled from a second conductive link between the second power supply and the second processing chamber. The conductive links can have the same impedance, resistance, and/or length.

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application is related to the following:

[0002] (a) U.S. Patent Application entitled “TRANSFER DEVICES FORHANDLING MICROELECTRONIC WORKPIECES WITHIN AN ENVIRONMENT OF APROCESSING MACHINE AND METHODS OF MANUFACTURING AND USING SUCH DEVICESIN THE PROCESSING OF MICROELECTRONIC WORKPIECES,” filed concurrently,and identified by Perkins Coie LLP Docket No. 291958153US;

[0003] (b) U.S. Patent Application entitled “INTEGRATED TOOLS WITHTRANSFER DEVICES FOR HANDLING MICROELECTRONIC WORKPIECES,” filedconcurrently, and identified by Perkins Coie Docket No. 291958153US1;

[0004] (c) U.S. Patent Application entitled “APPARATUS AND METHODS FORELECTROCHEMICAL PROCESSING OF MICROELECTRONIC WORKPIECES,” filed May 31,2001, and identified by Perkins Coie Docket No. 291958158US;

[0005] (d) U.S. Patent Application entitled “ADAPTABLE ELECTROCHEMICALPROCESSING CHAMBER,” filed concurrently, and identified by Perkins CoieLLP Docket No. 291958156US;

[0006] (e) U.S. Patent Application entitled “LIFT AND ROTATE ASSEMBLYFOR USE IN A WORKPIECE PROCESSING STATION AND A METHOD OF ATTACHING THESAME,” filed concurrently, and identified by Perkins Coie Docket No.291958154US;

[0007] (f) U.S. Patent Application entitled “TUNING ELECTRODES USED IN AREACTOR FOR ELECTROCHEMICALLY PROCESSING A MICROELECTRONIC WORKPIECE,”filed on May 24, 2001, and identified by Perkins Coie Docket No.291958157US1.

[0008] All of the foregoing U.S. Patent Applications in paragraphs(a)-(f) above are herein incorporated by reference.

TECHNICAL FIELD

[0009] The present invention is directed toward methods and apparatusesfor distributing power in microelectronic workpiece processing tools.

BACKGROUND

[0010] Microelectronic workpieces, such as semiconductor wafers,typically undergo several processing steps within a single enclosedenvironment. For example, microelectronic workpieces can be plated,annealed, etched, and cleaned in a plurality of processing chambers thatare located within a single housing or cabinet. These processes can beperformed on each workpiece individually in separate single-waferprocessing chambers, which is referred to in the industry as“single-wafer processing.” The workpieces are thus typically transferredfrom one processing station to another within the housing.

[0011]FIG. 1 illustrates an apparatus 10 for single-wafer processing inaccordance with one embodiment of an LT-210C available from Semitool,Inc. of Kalispell, Mont. The apparatus 10 includes a housing 11 thatencloses a plurality of processing chambers 20 and a workpiece loader 12that receives containers 13 filled with microelectronic workpieces 14.The apparatus 10 also includes a robot 15 that removes the workpieces 14from the containers 13, moves the workpieces 14 among the processingchambers 20, and returns the processed workpieces 14 to the containers13.

[0012] As shown in FIG. 1, the apparatus 10 includes a central powersupply 30 that receives, for example, AC power and converts the AC powerto other waveforms for use throughout the tool. For example, the outputof the power supply 30 is provided to each of the electrodes in theplating chambers. Additional power supplies are generally used tooperate solenoid valves 50 for directing fluid to and from theprocessing chambers 20, the workpiece loader 12 (to drive the motors andactuators that move and access the containers 13), and to two headcontrollers 40 (one of which is visible in FIG. 1). The head controllers40 are coupled to the processing chambers 20 to drive the motors thatopen, close, and otherwise operate the chambers 20.

[0013] The power provided from the power supply 30 to the electrodes inthe processing chambers and the power provided from other power sourcesto other components of the tool are conducted along a power distributionnetwork that typically comprises a variety of cable types that havedifferent electrical characteristics (i.e., physical construction,impedance, electromagnetic coupling, noise immunity, etc.). Althoughvariation in the electrical characteristics of the cables may betolerable for the power conducted to the motors used in processingchambers, even subtle variations between the electrical characteristicsof the power provided to the electrodes in the electrochemicalprocessing chambers can result in substantial differences andinconsistencies in the wafers.

[0014] One characteristic of some existing power distribution networksis that the power distribution lines used to provide power to electrodesin a first processing chamber may have different electricalcharacteristics than the power distribution lines that provide power toelectrodes in a second electrochemical processing chamber. Further, thepower distribution lines that provide power to the electrodes in theprocessing chambers may be electromagnetically coupled to other powerdistribution lines in the power distribution network in someapplications. The signals transmitted to one processing chamber over onepower line, for example, can be inductively and/or capacitively coupledwith signals transmitted to other components. Many applicationscompensate for such inductive and/or capacitive coupling by shieldingthe power lines, but even shielding may not provide adequate protectionin some instances. As a result, different processing chambers ofteneffectively receive different chemical processing power signals.

SUMMARY

[0015] The present invention is directed toward methods and apparatusesfor processing microelectronic workpieces. The present inventors haverecognized that there is a need to provide each of the electrochemicalprocessing chambers in a processing tool with at least substantially thesame electrochemical processing power to ensure consistent processingperformance between the various electrochemical processing chambers.Further, they have recognized that this can be accomplished by placing anumber of power supplies at various locations in a processing tool toreduce the impact that the cables in the power distribution network haveupon the effective signals received by the electrodes in theelectrochemical processing stations. The present inventors accordinglydeveloped various solutions to the foregoing problems that include, forexample, locating a plurality of power supplies throughout a processingapparatus so that the electrical links or other types of powerdistribution lines between the power supplies and the processingchambers have at least substantially the same electrical characteristicsand are not subject to extensive electromagnetic interference from othercables. Therefore, several embodiments of microelectronic processingtools in accordance with the invention provide at least substantiallythe same effective power to electrodes in electrochemical processingstations for enhancing the consistency in the plating performance ofsimilar electrochemical processing stations.

[0016] In one aspect of the invention, the apparatus can include ahousing at least partially enclosing a process environment. The housingcan include a first processing chamber having a first anode and a firstcathode, and a second processing chamber having a second anode and asecond cathode. A first power supply can be electrically coupled to thefirst processing chamber to provide electrical power to at least one ofthe first anode and the first cathode, and a second power supply can beelectrically coupled to the second processing chamber to provideelectrical power to at least one of the second anode and the secondcathode.

[0017] In several embodiments, the first power supply can be dedicatedto provide power to the first anode and the first cathode separate fromthe second power supply, and the second power supply can be dedicated toprovide power to the second anode and the second cathode separate fromthe first power supply. Unlike conventional systems that have a singlepower supply that provides power to the electrodes in all of theprocessing stations in a tool using cables of different lengths (andthus impedances), a further aspect of several of these embodiments isthat the first power supply can be electrically coupled to the firstprocessing chamber with a conductive link having a first impedance, andthe second power supply can be electrically coupled to the secondprocessing chamber with a conductive link having a second impedance atleast approximately the same as the first impedance. For example, thefirst and second conductive links can have approximately the samelengths and/or approximately the same resistances because the first andsecond power supplies can be located approximately the same distancesfrom the first and second processing stations, respectively. Thisaccordingly is expected to reduce the need to compensate for differencesin the signals caused by the links. In a further aspect of theinvention, the first and second power supplies can each include an inputportion configured to receive electrical power and an output portionconfigured to transmit electrical power. The output portion of each ofthe first and second power supplies can be electrically decoupled fromall other processing chambers of the housing.

[0018] In yet a further aspect of an embodiment of the invention, thefirst and second power supplies are separated from each other so thatthe first and second conductive links to the power supplies extendthrough separate raceways. This feature reduces the number of cables inclose proximity to each other, which is expected to reduce inductive andcapacitive coupling.

[0019] The invention is also directed toward a method for assembling atool for processing a microelectronic workpiece. In one aspect of theinvention, the method can include positioning a first processing chamberin a housing, with the first processing chamber having a first anode anda first cathode and being configured to process a microelectronicworkpiece. The method can further include positioning a secondprocessing chamber in the housing, with the second processing chamberhaving a second anode and a second cathode and being configured toprocess a microelectronic workpiece. The method can still furtherinclude coupling a first output portion of a first power supply to atleast one of the first anode and the first cathode, with the firstoutput portion electrically decoupled from the second anode and thesecond cathode. The method can further include coupling a second outputportion of a second power supply to at least one of the second anode andthe second cathode, with the second output portion electricallydecoupled from the first anode and the first cathode.

[0020] The invention is also directed toward a method for processingmicroelectronic workpieces. In one aspect of the invention, the methodcan include positioning a first microelectronic workpiece in a firstprocessing chamber located within a housing defining a processingenvironment, and positioning a second microelectronic workpiece in asecond processing chamber located within the housing. The method canfurther include providing power to at least one of a first anode andfirst cathode of the first processing chamber from a first outputportion of a first power supply, and providing power to at least one ofa second anode and a second cathode of the second processing chamberfrom a second output portion of a second power supply different than thefirst power supply. The power provided by the first power supply and thesecond power supply can be provided with the second output portionelectrically decoupled from the first anode and the first cathode, andthe first output portion electrically decoupled from the second anodeand the second cathode.

BRIEF DESCRIPTION OF THE DRAWINGS

[0021]FIG. 1 is an isometric view of a device configured to processmicroelectronic workpieces in accordance with the prior art with acut-away section to illustrate internal components.

[0022]FIG. 2 is an isometric view of an apparatus in accordance with anembodiment of the invention showing selected components schematically.

[0023]FIG. 3 is a block diagram illustrating components of an apparatusin accordance with an embodiment of the invention showing selectedcomponents schematically.

[0024]FIG. 4 is an isometric view of a conductor enclosure in accordancewith an embodiment of the invention.

DETAILED DESCRIPTION

[0025] The following disclosure describes methods and apparatuses fordistributing power to components of a tool for processingmicroelectronic workpieces. The term “microelectronic workpiece” is usedthroughout to include a workpiece formed from a substrate upon whichand/or in which microelectronic circuits or components, data storageelements or layers, and/or micro-mechanical elements are fabricated.Many specific details of certain embodiments of the invention are setforth in the following description and in FIGS. 2-4 to provide athorough understanding of these embodiments. One skilled in the art,however, will understand that the present invention may have additionalembodiments, and that the invention may be practiced without several ofthe details described below.

[0026]FIG. 2 illustrates an apparatus 110 in accordance with anembodiment of the invention. In one aspect of this embodiment, theapparatus 110 can include a housing 111 that defines a controlled cleanroom environment. The housing 111 can include a plurality of processingchambers 120 (four are shown in FIG. 2 as processing chambers 120 a-d),each of which can be configured to perform one or more processes on oneor more microelectronic workpieces 114. The workpieces 114 are initiallypositioned in containers 113, which are maneuvered into position,opened, and accessed at a workpiece loader 112. A robot (not shown inFIG. 2) removes the workpieces 114 from the containers 113, distributesthe workpieces 114 to the appropriate processing chambers 120 forprocessing, and returns the processed workpieces 114 to the container113. The workpiece loader 112 can include a device generally similar tothat disclosed in the U.S. Application entitled “Transfer Devices forHandling Microelectronic Workpieces Within an Environment of aProcessing Machine and Methods of Manufacturing and Using Such Devicesin the Processing of Microelectronic Workpieces” (Perkins Coie DocketNo. 291958153US) filed concurrently, which has been incorporated byreference above. The robot can include a device generally similar tothat disclosed in the U.S. Application entitled “Method and Apparatusfor Accessing Microelectronic Workpiece Containers” (Perkins Coie DocketNo. 291958103US) filed concurrently, which has been incorporated byreference above.

[0027] In one aspect of the embodiment shown in FIG. 2, the apparatus110 can include separate power supplies 130 (shown in FIG. 2 as powersupplies 130 a-d). Each power supply 130 can be dedicated to providepower to the electrodes of a single processing chamber 120. Accordingly,each power supply 130 generally has a power conditioning module 170(e.g., a rectifier/voltage regulator) at the front end to conditionincoming power to a state suitable for use with the electrodes. In analternate embodiment, each power supply 130 could be coupled to a valvecontrol module 150 to provide power to control devices of the processingchambers 120. The apparatus 110 can further include one or moreprotective conductor enclosures 131 that carry cables and/or otherconductive links between the power supplies 130 and the processingchambers 120. The operation of the power supplies 130 can be controlledby a microprocessor such as a system coordination computer 160 under thedirection of a user. Further details of the operation of the powersupplies 130 are described below with reference to the FIGS. 3 and 4.

[0028]FIG. 3 illustrates a block diagram of many of the components ofthe apparatus 110 described above with reference to FIG. 2. In oneembodiment, the apparatus 110 can include the four processing chambers120 a-d, each coupled to a corresponding dedicated power supply 130 a-d,as described above. For purposes of illustration, power supply 130 a andprocessing chamber 120 a are shown in greater detail than the remainingpower supplies 130 b-d and processing chambers 120 b-d. In otherembodiments, the apparatus 110 can have more or fewer processingchambers 120 coupled to dedicated power supplies 130. In any of theseembodiments, the power provided to one processing chamber 120 can bedecoupled from the power provided to some or all of the other processingchambers 120. As a result, communication between the power supplies 130and the processing chambers 120 can be more consistent from oneprocessing chamber 120 to the next, as described below.

[0029] In one embodiment, the processing chambers 120 can includeelectroplating chambers configured to plate conductive layers such asmetal layers on the microelectronic workpieces 114. For example, theprocessing chamber 120 can include features generally similar to thosedescribed in U.S. Pat. No. 6,228,232; U.S. Pat. No. 6,080,291; U.S.application Ser. No. 09/804,696, filed Mar. 12, 2001; and/or U.S.application Ser. No. 09/804,697, filed Mar. 12, 2001, all of which areincorporated herein in their entireties by reference. Accordingly, eachprocessing chamber 120 can include a cup 121 that supports a firstelectrode, such as an anode 125. The cup 121 receives processing fluid116 through a supply line 129 a that is regulated by a supply valve 127a. The processing fluid 116 can fill the cup 121 and spill over a weir122 into an overflow vessel 123. Accordingly, the weir 122 can definethe level of the processing fluid 116 in the cup 121. The processingfluid 116 can exit the processing chamber 120 through an exit line 129 bthat is regulated by an exit valve 127 b.

[0030] The processing chamber 120 can further include a head 124 orother support member that supports a microelectronic workpiece 114 incontact with the processing fluid 116. A second electrode, such as acathode 126, is positioned in the head 124 to apply an electricalpotential to the microelectronic workpiece 114. The head 124 can includea spin motor 128 a that spins the microelectronic workpiece 114 and thecathode 126 as the microelectronic workpiece 114 contacts the processingfluid. By applying a different potential to the anode than the cathode,the user can controllably apply conductive ions in the processing fluid116 to the surface of the workpiece 114 (or, alternatively, removeconductive material from the workpiece 114). It will be appreciated thatthe first and second electrodes can carry either a cathodic or an anodiccharge for either depositing or removing material from the workpieceaccording to the particular materials that are used in the processingchamber.

[0031] The head 124 can be coupled to a lift motor 128 c that lowers thehead 124 and the microelectronic workpiece 114 into contact with theprocessing fluid 116 in the cup 121. The head 124 can also include arotate motor 128 b that rotates the head 124 to an inverted position forplacing the microelectronic workpiece 114 in contact with the cathode126 prior to processing, and removing the microelectronic workpiece 114from the cathode 126 after processing.

[0032] The processing chambers 120 a-d and the system coordinationcomputer 160 are generally powered by other power supplies separate fromthe power supply 130. Accordingly, the apparatus 110 can include a powerswitch 161 coupleable to a source of power, such as a standard 110-220volt AC power source. The incoming power can be provided directly to thesystem coordination computer 160 and the power supplies 130 a-d.Alternatively, the system coordination computer 160 can receive powerfrom one of the power supplies 130, but this is not customary. In eitherembodiment, the system coordination computer 160 can be operativelycoupled to each of the power supplies 130 a-d to control some or allaspects of the operation of each power supply 130. For example, thesystem coordination computer 160 can send control signals to a modulecomputer 162 a that in turn sends control signals to the power supplies130. The system coordination computer 160 can also be coupled to othermodule computers (such as module computers 160 b and 160 c) to controlother aspects of the operation of the apparatus 110.

[0033] Each power supply 130 can be configured to step down, rectify,and control the power received from the high-voltage power source. Inone embodiment, the power supply 130 can correspond generally to adevice available from Dynatronix, Inc. of Amery, Wis. In otherembodiments, the power supply 130 can include other devices. In any ofthe foregoing embodiments, the power supply 130 can include an inputportion 135 that receives the high-voltage power from the AC powersource, and an output portion 136 that delivers controlled low-voltagecurrent to the processing chambers 120. The input portion 135 and theoutput portion 136 can include terminals or other conventionalelectrical couplings. The input portion 135 can be coupled to atransformer 173 having an input side 175 for receiving high-voltage ACcurrent, and an output side 176 for providing rectified low-voltage DCcurrent. For example, the transformer 173 can provide DC current at 48volts in one embodiment or other voltages in alternate embodiments. Inany of the foregoing embodiments, the output side 176 of the transformer173 can be coupled to a storage device 172, for example a capacitorbank, to store up charge for delivering electrical pulses to the anode125 and/or the cathode 126. The transformer 173 can also be coupled to asignal conditioner 171 that can control aspects of the signals deliveredto the anode 125 and/or the cathode 126. For example, the signalconditioner 171 can control characteristics such as duration, spacing,and amplitude of the electrical pulses delivered to the anode 125 and/orthe cathode 126.

[0034] Another power source separate from the power supply 130 isgenerally coupled to a valve controller 151 to control the operation ofthe valves 127 of the processing chamber 120. The valve controller 151can be positioned in the valve control module 150. In one aspect of thisembodiment, the valve control module 150 can have a standalone housing.Alternatively, the valve control module 150 and/or the valve controller151 can be located in the same housing as the transformer 173, thestorage device 171 and the signal conditioner 172. In either embodiment,the valve controller 151 can control the operation of electricallypowered valves, such as the supply valve 127 a, the exit valve 127 b orother valves of the apparatus 110.

[0035] A power source separate from the power supply 130 is alsogenerally coupled to a motor controller 181 to control the motors 128 a,128 b and 128 c of the processing chambers 120. In one aspect of thisembodiment, the motor controller 181 can be housed in the powerconditioning module 170 or the valve control module 150. Alternatively,the motor controller 181 can be housed in a separate motor controlmodule 180.

[0036] In the particular embodiment shown in FIG. 3, the output portions136 of the power supplies 130 are generally coupled only to theelectrodes in corresponding processing chambers 120 with conductivelinks 134 (shown individually in FIG. 3 as conductive links 134 a-b),such as electrical cables. Conductive links 134 a and 134 b can becoupled to the anode 125 and the cathode 126, respectively. Accordingly,the electrodes in each of the processing chambers 120 can receive powerfrom a single one of the power supplies 130. An advantage of thisarrangement is that the apparatus 110 can be manufactured in a modularfashion, with processing chambers 120 added to or removed from theapparatus 120 during manufacture without having to alter or re-select acentral power supply. A further advantage is that if a processingchamber 120 must be removed and replaced in the field, this operationcan be completed without having to alter or replace a central powersupply.

[0037] The other electrical components of the processing chambers 120can be coupled to power sources other than the power supplies 130 bylinks 134 c-134 g. As shown in FIG. 3, the valve control module 150 andthe motor control module 180 are powered by line power. As such, theconditioned power provided by the power supplies 130 a-d is typicallyused only for the electrodes in the processing chambers 120 in manyembodiments of the invention.

[0038] In one aspect of this embodiment, the conductive links 134 can beselected to improve the uniformity of the signals provided to each ofthe chambers 120 a-d independently of whether or not each processingchamber 120 is coupled to a dedicated power supply 130. For example,when the conductive links are coupled to identical or generally similarcomponents of different processing chambers 120, then the electricalproperties of these links can be at least approximately identical.Accordingly, each of the conductive links 134 a provided to the anodes125 of each chamber can have at least approximately the same length, andeach of the conductive links 134 b provided to the cathodes 126 can alsohave approximately the same length.

[0039] In a further aspect of this embodiment, each of the conductivelinks 134 a and 134 b can have the same impedance and/or the sameresistance for each of the chambers 120 a-d. An advantage of thisfeature is that the signals provided to the anodes 125 and cathodes 126in each of the chambers 120 a-d can be more uniform. For example, byproviding cables 134 a-b having at least approximately identical lengthsfor the processing chambers 120 a-d, the impedances and/or resistancesfor the cable are at least substantially the same for each chamber 120such that the signals applied to the anodes 125 and the cathodes 126 canbe more consistent from chamber to chamber, resulting in more uniformlyprocessed microelectronic workpieces 114.

[0040] In other embodiments, the conductive links 134 can have otherarrangements for at least approximately matching the impedances ofconductive paths to similar components of different chambers 120. Forexample, the conductive links 134 can have different lengths, but caninclude a resistor or a resistor in parallel with a capacitor to matchthe resistance or impedance of other conductive links 134 connected tosimilar components.

[0041] Another feature of an embodiment of the arrangement describedabove with reference to FIGS. 2 and 3 is that each power supply 130 canbe positioned close to its corresponding processing chamber 120.Accordingly, the length of the conductive links 134 between the powersupply 130 and the processing chamber 120 can be less than for someconventional arrangements. An advantage of this feature is that theresistance of the conductive links will be less likely to affect thestrength of the signals carried over the conductive links 134. A furtheradvantage is that the shorter conductive links 134 will be less likelyto be affected by signals from other conductors within the apparatus 110to inhibit inductive or capacitive coupling.

[0042] In other embodiments, other conductive links 134 can also beselected to have similar or identical properties. For example, whenother electrically operated devices of the processing chambers 120 arequire or benefit from more consistent signals, these devices can becoupled to conductive links having uniform conductive properties. Theseconductive links can be applied to the processing chambers 120 when theprocessing chambers include electroplating vessels (as shown in FIG. 3)or, alternatively, when the processing chambers include other devices,such as annealing chambers, cleaning chambers, metrology chambers, orchambers configured to carry out other processes on the microelectronicworkpieces 114.

[0043]FIG. 4 illustrates a protective conductor enclosure 131 configuredto route conductive links 134 in accordance with an embodiment of theinvention. In one aspect of this embodiment, the conductor enclosure 131can include a raceway 132 configured to carry conductive links 134 fromtwo power supplies 130 (FIG. 2) to two corresponding processing chambers120 (FIG. 2). In a further aspect of this embodiment, the raceway 132can include two conduits 133 a and 133 b, each of which carries twoconductive links 134 a and 134 b for coupling to the anode 125 (FIG. 3)and the cathode 126 (FIG. 3) of the processing chamber 120 (FIG. 3).Each conductive link 134 a and 134 b can include a shielded cable.Accordingly, the conductor enclosure 131 can protect and route theconductive links 134, and the conduits 133 a and 133 b can shield theconductive links coupled to one processing chamber 120 from signalstransmitted along the conductive links coupled to a neighboringprocessing chamber 120. An advantage of this arrangement is that signalscommunicated along one set of conductive links 134 a and 134 b can beless likely to influence or interfere with signals conducted along theconductive links 134 a and 134 b of a neighboring processing chamber120.

[0044] From the foregoing, it will be appreciated that specificembodiments of the invention have been described herein for purposes ofillustration, but various modifications may be made without deviatingfrom the spirit and scope of the invention. For example, in oneembodiment, a single power supply 130 can provide power to electrodes inmultiple processing chambers 120 while still providing advantages suchas matched conductive link impedances and/or lengths. Accordingly, theinvention is not limited except as by the appended claims.

1. An apparatus for processing microelectronic workpieces, comprising: ahousing at least partially enclosing a process environment; a firstprocessing chamber within the housing, the first processing chamberhaving a first anode and a first cathode; a second processing chamberwithin the housing, the second processing chamber having a second anodeand a second cathode; a first power supply located a first distance fromthe first processing chamber and electrically coupled to the firstprocessing chamber to provide electrical power to at least one of thefirst anode and the first cathode; and a second power supply located asecond distance from the second processing chamber and electricallycoupled to the second processing chamber to provide electrical power toat least one of the second anode and the second cathode, wherein thefirst distance is at least approximately the same as the seconddistance.
 2. The apparatus of claim 1 wherein the first power supplyincludes a first input portion configured to receive electrical powerand a first output portion configured to transmit electrical power, andwherein the second power supply includes a second input portionconfigured to receive electrical power and a second output portionconfigured to transmit electrical power, and wherein the first outputportion is electrically decoupled from the second output portion.
 3. Theapparatus of claim 1 wherein: the first processing chamber includes afirst electroplating vessel and at least one first fluid control valvepositioned to control a flow of fluid into and/or out of the firstelectroplating vessel; and wherein the second processing chamberincludes a second electroplating vessel and at least one second fluidcontrol valve positioned to control a flow of fluid into and/or out ofthe second electroplating vessel; further wherein the first power supplyincludes a first transformer configured to step electrical current downfrom a first potential to a second potential, the first power supplybeing electrically coupled to the first anode and the first cathode;still further wherein the second power supply includes a secondtransformer configured to step electrical current down from the firstpotential to the second potential, the second power supply beingelectrically coupled to the second anode and the second cathode.
 4. Theapparatus of claim 1, further comprising: a first protective enclosurepositioned between the first power supply and the first processingchamber; a first electrical conductor disposed in the first enclosureand connected between the first power supply and the first processingchamber; a second protective enclosure positioned between the secondpower supply and the second processing chamber; and a second electricalconductor disposed in the second enclosure and coupled between thesecond power supply and the second processing chamber.
 5. The apparatusof claim 1, further comprising: a protective raceway positioned betweenthe power supplies and the processing chambers; first and secondconduits positioned within the protective raceway; a first electricalconductor disposed in the first conduit and connected between the firstpower supply and the first processing chamber; and a second electricalconductor disposed in the second conduit and coupled between the secondpower supply and the second processing chamber.
 6. The apparatus ofclaim 1, further comprising: a first electrical conductor coupledbetween the first power supply and the first processing chamber, thefirst electrical conductor having a first length; and a secondelectrical conductor coupled between the second power supply and thesecond processing chamber, the second electrical conductor having asecond length at least approximately the same as the first length. 7.The apparatus of claim 1 wherein the first processing chamber includes avessel and an electrically operated valve in fluid communication withthe vessel to control a flow of processing fluid into or out of thevessel, and wherein a separate power supply is electrically coupled tothe valve.
 8. The apparatus of claim 1 wherein the first power supplyincludes a first step-down transformer having an input side coupleableto a source of electrical power and an output side coupled to the firstprocessing chamber, and wherein the second power supply includes asecond step-down transformer having an input side coupleable to thesource of electrical power and an output side coupled to the secondprocessing chamber, still further wherein the output side of the firststep-down transformer is electrically isolated from the output side ofthe second step-down transformer.
 9. An apparatus for processingmicroelectronic workpieces, comprising: a housing at least partiallyenclosing a process environment; a first processing chamber within thehousing, the first processing chamber having at least one firstelectrically powered device; a second processing chamber within thehousing, the second processing chamber having at least one secondelectrically powered device; a first power supply electrically coupledto the first processing chamber to provide electrical power to the atleast one first electrically powered device, the first power supplyhaving an input portion configured to receive electrical power and anoutput portion configured to transmit electrical power, the outputportion being electrically decoupled from all other processing chambersof the housing; and a second power supply electrically coupled to thesecond processing chamber to provide electrical power to the at leastone second electrically powered device, the second power supply havingan input portion configured to receive electrical power and an outputportion to transmit electrical power, the output portion of the secondpower supply being electrically decoupled from all other processingchambers of the housing.
 10. The apparatus of claim 9 wherein: the firstprocessing chamber includes a first electroplating vessel having a firstanode and a first cathode; and wherein the second processing chamberincludes a second electroplating vessel having a second anode and asecond cathode; further wherein the first power supply includes a firsttransformer configured to step electrical current down from a firstpotential to a second potential, the first power supply beingelectrically coupled to the first anode and the first cathode; stillfurther wherein the second power supply includes a second transformerconfigured to step electrical current down from the first potential tothe second potential, the second power supply being electrically coupledto the second anode and the second cathode.
 11. The apparatus of claim9, further comprising: a first electrical conductor coupled between thefirst power supply and the first processing chamber, the firstelectrical conductor having a first length; and a second electricalconductor coupled between the second power supply and the secondprocessing chamber, the second electrical conductor having a secondlength at least approximately the same as the first length.
 12. Theapparatus of claim 9, further comprising: a power switch coupleable to asource of electrical power; a first electrical connection between thepower switch and the first power supply; and a second electricalconnection between the power switch and the second power supply.
 13. Theapparatus of claim 9, further comprising: a first protective enclosurepositioned between the first power supply and the first processingchamber; a first electrical conductor disposed in the first enclosureand connected between the first power supply and the first processingchamber; a second protective enclosure positioned between the secondpower supply and the second processing chamber; and a second electricalconductor disposed in the second enclosure and coupled between thesecond power supply and the second processing chamber.
 14. The apparatusof claim 9, further comprising: a raceway positioned between the powersupplies and the processing chambers; first and second conduitspositioned within the raceway; a first electrical conductor disposed inthe first conduit and connected between the first power supply and thefirst processing chamber; and a second electrical conductor disposed inthe second conduit and coupled between the second power supply and thesecond processing chamber.
 15. The apparatus of claim 9 wherein thefirst processing chamber includes an anode and the first power supply iselectrically coupled to the anode.
 16. The apparatus of claim 9 whereinthe first processing chamber includes a cathode and the first powersupply is electrically coupled to the cathode.
 17. The apparatus ofclaim 9 wherein the first power supply includes a first step-downtransformer having an input side coupleable to a source of electricalpower and an output side coupled to the first processing chamber, andwherein the second power supply includes a second step-down transformerhaving an input side coupleable to the source of electrical power and anoutput side coupled to the second processing chamber.
 18. The apparatusof claim 9 wherein: the first processing chamber includes a firstplating chamber having a first fluid vessel disposed within a firstoverflow vessel, a first anode disposed within the first fluid vessel,and a first cathode positioned proximate to the first fluid vessel andconfigured to be electrically coupled to a microelectronic workpiece, atleast one of the first anode and the first cathode being coupled to thefirst power supply; and wherein the second processing chamber includes asecond plating chamber having a second fluid vessel disposed within asecond overflow vessel, a second anode disposed within the second fluidvessel, and a second cathode positioned proximate to the second fluidvessel and configured to be electrically coupled to a microelectronicworkpiece, at least one of the second anode and the second cathode beingcoupled to the second power supply.
 19. An apparatus for processingmicroelectronic workpieces, comprising: a housing at least partiallyenclosing a process environment; a first processing chamber within thehousing, the first processing chamber having at least one firstelectrically powered device; a second processing chamber within thehousing, the second processing chamber having at least one secondelectrically powered device; a first power supply; a second powersupply; a first electrical link coupled between the first power supplyand the first processing chamber to transmit electrical power from thefirst power supply to the at least one first electrically powereddevice, the first electrical link having a first impedance; and a secondelectrical link coupled between the second power supply and the secondprocessing chamber to transmit electrical power from the second powersupply to the at least one second electrically powered device, thesecond electrical link having a second impedance at least approximatelyidentical to the first impedance.
 20. The apparatus of claim 19 whereinthe first power supply includes an input portion configured to receiveelectrical power and an output portion coupled to the first electricallink, and wherein the second power supply includes an input portionconfigured to receive electrical power and an output portion coupled tothe second electrical link, still further wherein the output portion ofthe first power supply is electrically decoupled from the output portionof the second power supply.
 21. The apparatus of claim 19 wherein thefirst electrically powered device includes at least one of a first anodeand a first cathode, and wherein the second electrically powered deviceincludes at least one of a second anode and a second cathode, andwherein the first electrical link includes a first cable having a firstlength and a first resistance, further wherein the second electricallink includes a second cable having a second length approximately thesame as the first length and a second resistance approximately the sameas the first resistance.
 22. The apparatus of claim 19 wherein: thefirst processing chamber includes a first electroplating vessel having afirst anode and a first cathode; and wherein the second processingchamber includes a second electroplating vessel having a second anodeand a second cathode; further wherein the first power supply includes afirst transformer configured to step electrical current down from afirst potential to a second potential, the first power supply beingelectrically coupled to the first anode and the first cathode; stillfurther wherein the second power supply includes a second transformerconfigured to step electrical current down from the first potential tothe second potential, the second power supply being electrically coupledto the second anode and the second cathode.
 23. The apparatus of claim19, further comprising: a first protective enclosure positioned betweenthe first power supply and the first processing chamber, the firstprotective enclosure being disposed around the first electrical link;and a second protective enclosure positioned between the second powersupply and the second processing chamber, the second protectiveenclosure being disposed around the second electrical link.
 24. Theapparatus of claim 19, further comprising: a raceway positioned betweenthe power supplies and the processing chambers; and first and secondconduits positioned within the raceway, with the first electrical linkdisposed within the first conduit and the second electrical linkdisposed within the second conduit.
 25. The apparatus of claim 19wherein the first processing chamber includes an anode and the firstpower supply is electrically coupled to the anode.
 26. The apparatus ofclaim 19 wherein the first processing chamber includes a cathode and thefirst power supply is electrically coupled to the cathode.
 27. Theapparatus of claim 19 wherein the first power supply includes a firststep-down transformer having an input side coupleable to a source ofelectrical power and an output side coupled to the first processingchamber, and wherein the second power supply includes a second step-downtransformer having an input side coupleable to the source of electricalpower and an output side coupled to the second processing chamber. 28.The apparatus of claim 19 wherein: the first processing chamber includesa first plating chamber having a first fluid vessel disposed within afirst overflow vessel, a first anode disposed within the first fluidvessel, and a first cathode positioned proximate to the first fluidvessel and configured to be electrically coupled to a microelectronicworkpiece, at least one of the first anode and the first cathode beingcoupled to the first power supply; and wherein the second processingchamber includes a second plating chamber having a second fluid vesseldisposed within a second overflow vessel, a second anode disposed withinthe second fluid vessel, and a second cathode positioned proximate tothe second fluid vessel and configured to be electrically coupled to amicroelectronic workpiece, at least one of the second anode and thesecond cathode being coupled to the second power supply.
 29. Anapparatus for processing microelectronic workpieces, comprising: ahousing at least partially enclosing a process environment; a firstprocessing chamber within the housing, the first processing chamberhaving a first vessel configured to contain a processing liquid, a firstanode disposed in the first vessel, and a first cathode configured to beelectrically coupled to a microelectronic workpiece; a second processingchamber within the housing, the second processing chamber having asecond vessel configured to contain a processing liquid, a second anodedisposed in the second vessel, and a second cathode configured to beelectrically coupled to a microelectronic workpiece; a first powersupply electrically coupled to at least one of the first anode and thefirst cathode with a first electrical link having a first length; and asecond power supply electrically coupled to at least one of the secondanode and the second cathode with a second electrical link having asecond length at least approximately identical to the first length. 30.The apparatus of claim 29, further comprising: a raceway positionedbetween the power supplies and the processing chambers; and first andsecond conduits positioned within the raceway, with the first electricallink disposed within the first conduit and the second electrical linkdisposed within the second conduit.
 31. The apparatus of claim 29wherein the first and second electrical links have approximately thesame resistance.
 32. An apparatus for processing a microelectronicsubstrate, comprising: a housing at least partially enclosing a processenvironment; a first electroplating chamber in the housing, the firstelectroplating chamber having a first processing vessel configured tocontain a processing fluid, the first electroplating chamber furtherhaving at least one electrically operated valve positioned to control aflow of the processing fluid into and/or out of the first processingvessel, the first electroplating chamber still further having an anodedisposed within the first processing vessel, and a cathode configured tobe electrically coupled to a microelectronic workpiece; a first powersupply having an input portion configured to receive electrical powerand an output portion electrically coupled to the anode and the cathode;a second electroplating chamber in the housing, the secondelectroplating chamber having a second processing vessel configured tocontain a processing fluid, the second electroplating chamber furtherhaving at least one electrically operated valve positioned to control aflow of the processing fluid into and/or out of the second processingvessel, the second electroplating chamber still further having an anodedisposed within the second processing vessel, and a cathode configuredto be electrically coupled to a microelectronic workpiece; and a secondpower supply having an input portion configured to receive electricalpower and an output portion electrically coupled to the anode and thecathode, wherein the output portion of the second power supply iselectrically isolated from the anode, the cathode and the at least onevalve of the first electroplating chamber, and the output portion of thefirst power supply is electrically isolated from the anode, the cathodeand the at least one valve of the second electroplating chamber.
 33. Theapparatus of claim 32, further comprising: a first conductive linkbetween the first power supply and the first anode, the first conductivelink having a first resistance; and a second conductive link between thesecond power supply and the second anode, the second conductive linkhaving a second resistance at least approximately the same as the firstresistance.
 34. The apparatus of claim 32, further comprising: a firstconductive link between the first power supply and the first cathode,the first conductive link having a first resistance; and a secondconductive link between the second power supply and the second cathode,the second conductive link having a second resistance at leastapproximately the same as the first resistance.
 35. The apparatus ofclaim 32, further comprising: a first electrical cable coupled betweenthe first power supply and the first anode, the first electrical cablehaving a first length; and a second electrical cable coupled between thesecond power supply and the second anode, the second electrical cablehaving a second length at least approximately the same as the firstlength.
 36. The apparatus of claim 32, further comprising: a firstelectrical cable coupled between the first power supply and the firstcathode, the first electrical cable having a first length; and a secondelectrical cable coupled between the second power supply and the secondcathode, the second electrical cable having a second length at leastapproximately the same as the first length.
 37. An apparatus forprocessing microelectronic workpieces, comprising: a processing chamberhaving a vessel configured to hold a processing fluid; a first electrodedisposed within the vessel; a second electrode positioned proximate tothe vessel and configured to be removably electrically coupled to amicroelectronic workpiece; and a power supply positioned proximate tothe processing chamber and having an input portion configured to receiveelectrical power, the power supply further having an output portionelectrically coupled to the first and second electrodes, the outputportion being electrically decoupled from electrodes of any otherprocessing chambers.
 38. The apparatus of claim 37, further comprising:a protective enclosure positioned between the power supply and theprocessing chamber; and an electrical conductor disposed in theenclosure and connected between the power supply and the processingchamber.
 39. The apparatus of claim 37, further comprising: a racewaypositioned between the power supply and the processing chamber; aconduit positioned within the raceway; and an electrical conductordisposed in the conduit and connected between the power supply and theprocessing chamber.
 40. The apparatus of claim 37 wherein the powersupply includes a step-down transformer having an input side coupleableto a source of electrical power and an output side coupled to theprocessing chamber.
 41. An apparatus for processing microelectronicworkpieces, comprising: a processing chamber having a vessel configuredto hold a processing fluid for electroplating a microelectronicworkpiece; an anode disposed within the vessel; a support memberconfigured to engage and support a microelectronic workpiece, thesupport member having a cathode configured to be removably electricallycoupled to a microelectronic workpiece; an electrically powered fluidcontrol valve in fluid communication with the vessel to control a flowof fluid into and/or out of the vessel; and a power supply positionedproximate to the processing chamber, the power supply having an inputportion configured to receive electrical power and an output portionelectrically coupled to at least one of the anode and the cathode, theoutput portion of the power supply being decoupled from anodes, cathodesand actuators of any other vessels for processing microelectronicworkpieces.
 42. The apparatus of claim 41, further comprising: aprotective enclosure positioned between the power supply and theprocessing chamber; and an electrical conductor disposed in theenclosure and connected between the power supply and the processingchamber.
 43. The apparatus of claim 41, further comprising: a racewaypositioned between the power supply and the processing chamber; aconduit positioned within the raceway; and an electrical conductordisposed in the conduit and connected between the power supply and theprocessing chamber.
 44. The apparatus of claim 41 wherein the powersupply includes a step-down transformer having an input side coupleableto a source of electrical power and an output side coupled to theprocessing chamber.
 45. An apparatus for processing microelectronicworkpiece, comprising: housing means for at least partially enclosing aprocess environment; first processing means for processing amicroelectronic workpiece, the first processing means being positionedwithin the housing means and having a first anode and a first cathode;second processing means for processing a microelectronic workpiece, thesecond processing means being positioned within the housing means andhaving a second anode and a second cathode; first electrical power meanselectrically coupled to the first processing means for providingelectrical power to at least one of the first cathode and the firstanode; and second electrical power means electrically coupled to thesecond processing means for providing electrical power to at least oneof the second cathode and the second anode.
 46. The apparatus of claim45 wherein the first electrical power means includes a first inputportion configured to receive electrical power, and a first outputportion configured to transmit electrical power, and wherein the secondelectrical power means includes a second input portion configured toreceive electrical power, and a second output portion configured totransmit electrical power, and wherein the first output portion iselectrically decoupled from the second output portion.
 47. The apparatusof claim 45, further comprising: first conductor means for providingpower to the first processing means, the first conductor means beingcoupled between the first electrical power means and the firstprocessing means and having a first length; and second conductor meansfor providing power to the second processing means, the second conductormeans being coupled between the second electrical power means and thesecond processing means and having a second length approximately equalto the first length.
 48. The apparatus of claim 45, further comprising:first conductor means for providing power to the first processing means,the first conductor means being coupled between the first electricalpower means and the first processing means and having a first impedance;and second conductor means for providing power to the second processingmeans, the second conductor means being coupled between the secondelectrical power means and the second processing means and having asecond impedance approximately equal to the first impedance.
 49. Amethod for assembling a tool for processing a microelectronic workpiece,comprising: positioning a first processing chamber in a housing, thefirst processing chamber having a first anode and a first cathode andbeing configured to process a microelectronic workpiece; positioning asecond processing chamber in the housing, the second processing chamberhaving a second anode and a second cathode and being configured toprocess a microelectronic workpiece; coupling a first output portion ofa first power supply to at least one of the first anode and the firstcathode, with the first output portion electrically decoupled from thesecond anode and the second cathode; and coupling a second outputportion of a second power supply to at least one of the second anode andthe second cathode, with the second output portion electricallydecoupled from the first anode and the first cathode.
 50. The method ofclaim 49, further comprising: coupling the first and second powersupplies to a common power switch; and coupling the common power switchto a source of electrical power.
 51. The method of claim 49, furthercomprising: coupling a first conductive link between the first powersupply and the first processing chamber; disposing the first conductivelink in a protective enclosure positioned between the first power supplyand the first processing chamber; coupling a second conductive linkbetween the second power supply and the second processing chamber; anddisposing the second conductive link in a protective enclosurepositioned between the second power supply and the second processingchamber, with the second conductive link electrically decoupled from thefirst conductive link.
 52. The method of claim 49, further comprising:disposing a raceway between the power supplies and the processingchambers; disposing first and second conduits within the raceway;disposing a first electrical conductor in the first conduit andconnecting the first electrical conductor between the first power supplyand the first processing chamber; and disposing a second electricalconductor in the second conduit and connecting the second electricalconductor between the second power supply and the second processingchamber.
 53. The method of claim 49, further comprising: coupling afirst electrical conductor between the first power supply and at leastone of the first anode and the first cathode; coupling a secondelectrical conductor between the second power supply and at least one ofthe second anode and the second cathode; and selecting the first andsecond electrical conductors to have approximately the same lengths. 54.The method of claim 49, further comprising: selecting a first conductivelink between the first power supply and at least one of the first anodeand the first cathode to have a first electrical resistance; andselecting a second conductive link between the second power supply andat least one of the second anode and the second cathode to have a secondelectrical resistance approximately the same as the first electricalresistance.
 55. The method of claim 49, further comprising: selectingthe first processing chamber to include a vessel having an electricallyoperated valve in fluid communication with the vessel to control a flowof processing fluid into or out of the vessel; and coupling a differentpower supply to the valve.
 56. The method of claim 49, furthercomprising: selecting the first power supply to include a firststep-down transformer having an input side and an output side; couplingthe input side of the first step-down transformer to a source ofelectrical power and coupling the output side of the first step-downtransformer to at least one of the first anode and the first cathode;selecting the second power supply to include a second step-downtransformer having an input side and an output side; and coupling theinput side of the second step-down transformer to the source ofelectrical power and coupling the output side of the second step-downtransformer to at least one of the second anode and the second cathode.57. A method for assembling a tool for processing a microelectronicworkpiece, comprising: positioning a first processing chamber in ahousing, the first processing chamber having at least one firstelectrically powered device and being configured to process amicroelectronic workpiece; positioning a second processing chamber inthe housing, the second processing chamber having at least one secondelectrically powered device and being configured to process amicroelectronic workpiece; coupling a first conductive link between afirst power supply and the first processing chamber to power and/orcontrol the first electrically powered device of the first processingchamber, the first conductive link having a first impedance; andcoupling a second conductive link between the first or a second powersupply and the second processing chamber to power and/or control thesecond electrically powered device of the second processing chamber, thesecond conductive link having a second impedance at least approximatelythe same as the first impedance.
 58. The method of claim 57, furthercomprising coupling the second conductive link between the secondprocessing chamber and a second power supply different than the firstpower supply, wherein an output portion of the first power supply iselectrically decoupled from all processing chambers of the housing otherthan the first processing chamber, and an output portion of the secondpower supply is electrically decoupled from all processing chambers ofthe housing other than the second processing chamber.
 59. The method ofclaim 57, further comprising selecting the first and second conductivelinks to have approximately the same resistances.
 60. The method ofclaim 57, further comprising selecting the first and second conductivelinks to have approximately the same lengths.
 61. The method of claim57, further comprising selecting the first electrically powered deviceto include an anode or a cathode.
 62. A method for assembling a tool forprocessing a microelectronic workpiece, comprising: positioning a firstprocessing chamber in a housing, the first processing chamber having atleast one electrically powered device and being configured to process amicroelectronic workpiece; positioning a second processing chamber inthe housing, the second processing chamber having at least oneelectrically powered device and being configured to process amicroelectronic workpiece; coupling a first conductive link between afirst power supply and the first processing chamber to power and/orcontrol the electrically powered device of the first processing chamber,the first conductive link having a first length; and coupling a secondconductive link between the first or a second power supply and thesecond processing chamber to power and/or control the electricallypowered device of the second processing chamber, the second conductivelink having a second length at least approximately the same as the firstlength.
 63. The method of claim 62, further comprising coupling thesecond conductive link between the second processing chamber and asecond power supply different than the first power supply, wherein anoutput portion of the first power supply is electrically decoupled fromall processing chambers of the housing other than the first processingchamber, and an output portion of the second power supply iselectrically decoupled from all processing chambers of the housing otherthan the second processing chamber.
 64. The method of claim 62, furthercomprising selecting the first and second conductive links to haveapproximately the same resistances.
 65. The method of claim 62, furthercomprising selecting the first and second conductive links to haveapproximately the same impedances.
 66. The method of claim 62, furthercomprising selecting the first electrically powered device to include ananode or a cathode.
 67. A method for replacing a processing chamber andpower supply of an apparatus for processing microelectronic workpieces,comprising: accessing a tool having a housing with a first processingchamber and a second processing chamber, each processing chamber beingconfigured to process a microelectronic workpiece, the first processingchamber being electrically coupled to an output portion of a first powersupply, the output portion of the first power supply being electricallyisolated from a second power supply, the second processing chamber beingelectrically coupled to an output portion of the second power supply,the output portion of the second power supply being electricallyisolated from the first power supply; and removing the first processingchamber and the first power supply from the tool without altering anelectrical coupling between the second processing chamber and the secondpower supply.
 68. The method of claim 67 wherein removing the firstprocessing chamber includes removing at least one of an anode and acathode coupled to the first power supply.
 69. A method for processingmicroelectronic workpieces, comprising: positioning a firstmicroelectronic workpiece in a first processing chamber located within ahousing defining a processing environment; positioning a secondmicroelectronic workpiece in a second processing chamber located withinthe housing; providing power to at least one of a first anode and afirst cathode of the first processing chamber from a first outputportion of a first power supply; and providing power to at least one ofa second anode and a second cathode of the second processing chamberfrom a second output portion of a second power supply different than thefirst power supply, with the second output portion electricallydecoupled from the first anode and the first cathode, and the firstoutput portion electrically decoupled from the second anode and thesecond cathode.
 70. The method of claim 69 wherein providing power to atleast one of the first anode and the first cathode includes providingpower over a first conductive link having a first impedance, and whereinproviding power to at least one of a second anode and a second cathodeincludes providing power over a second conductive link having a secondimpedance at least approximately the same as the first impedance. 71.The method of claim 69 wherein providing power to at least one of thefirst anode and the first cathode includes providing power over a firstconductive link having a first length, and wherein providing power to atleast one of a second anode and a second cathode includes providingpower over a second conductive link having a second length at leastapproximately the same as the first length.
 72. A method for processingmicroelectronic workpieces, comprising: positioning a firstmicroelectronic workpiece in a first processing chamber located within ahousing defining a processing environment; positioning a secondmicroelectronic workpiece in a second processing chamber located withinthe housing; providing power to at least one of a first anode and afirst cathode of the first processing chamber from a first outputportion of a first power supply via a first conductive link having afirst impedance; and providing power to at least one of a second anodeand a second cathode of the second processing chamber from a secondoutput portion of a second power supply different than the first powersupply via a second conductive link having a second impedance at leastapproximately the same as the first impedance.
 73. The method of claim72 wherein providing power to at least one of a first anode and a secondanode includes providing power over the a first conductive link having alength approximately the same as a length of the second conductive link.74. The method of claim 72 wherein providing power from the first outputportion includes providing power from the first output portion to atleast one of the first anode and the first cathode without providingpower from the first output portion to the second anode or the secondcathode, and wherein providing power from the second output portionincludes providing power from the first output portion to at least oneof the second anode and the second cathode without providing power fromthe second output portion to the first anode or the first cathode. 75.An apparatus for electrochemically processing a microelectronicworkpiece comprising: a first electrochemical processing reactorincluding first and second electrodes disposed to electrochemicallyprocess a microelectronic workpiece at the first electrochemicalprocessing reactor: a second electrochemical processing reactorincluding first and second electrodes disposed to electrochemicallyprocess a microelectronic workpiece at the second electrochemicalprocessing reactor; a power supply having one or more power outputs toprovide electrochemical processing power to the first and secondelectrode of the first electrochemical processing reactor and the firstand second electrodes of the second electrochemical processing reactor;and a power distribution system connecting the one or more power outputsof the power supply to the electrodes of the first and secondelectrochemical processing reactors so that the characteristics of theelectrochemical processing reactor is substantially the same as thecharacteristics of the electrochemical processing power reaching thefirst and second electrodes of the second electrochemical processingreactor.
 76. The apparatus of claim 75 wherein the power distributionsystem comprises a current adjustment circuit respectively associatedwith each of the first and second electrochemical processing reactors.77. The apparatus of claim 75 wherein the power distribution systemcomprises an impedance matching circuit respectively associated witheach of the first and second electrochemical processing reactors. 78.The apparatus of claim 75 wherein the power distribution systemcomprises a power conditioning circuit respectively associated with eachof the first and second electrochemical processing reactors.
 79. Anapparatus for electrochemical processing microelectronic workpiecescomprising: a first electrochemical processing reactor including firstand second electrodes disposed to electrochemically process amicroelectronic workpiece at the first electrochemical processingreactor; a second electrochemical processing reactor including first andsecond electrodes disposed to electrochemically process amicroelectronic workpiece at the second electrochemical processingreactor; and a power supply and distribution system providingelectrochemical processing power to the electrodes of the first andsecond electrochemical processing reactors so that the characteristicsof the electrochemical processing power reaching the first and secondelectrodes of the first electrochemical processing reactor issubstantially the same as the characteristics of the electrochemicalprocessing power reaching the first and second electrodes of the secondelectrochemical processing reactor.